PVA has unveiled the next generation of high speed semiconductor packaging dispense systems
with the PVA850. Touting speed and accuracy capability unique to the adhesive dispensing industry, the PVA850 will provide throughput and flexibility unlike any rival. PVA’s robust gantry design can accommodate multiple dispense heads and requires no periodic positional calibration. The PVA850 is ideally suited for any underfill, glob top, dam and fill, wire bond, or die attach dispensing process where high speed, accuracy, and flexibility are of the highest demand.
The PVA850 is ideal for SMT dispensing applications that include edge bonding, surface mount adhesive, solder paste, and conductive adhesives. Common semiconductor packaging processes include underfill, encapsulation, dam and fill, glob top, thermal grease, lid seal, and die attach.
The PVA850 has many integrated features including:
- Robotic system accuracy of 25 microns
- Active vision system with fiducial recognition and correction
- Closed loop process control from gantry system to dispense valve
- Maximum axis speed of 1750 mm/sec (68.9”/sec) and 2g acceleration for incredibly high throughput
- Micron level encoder resolution for unparalleled dispensing accuracy
- Exclusive PathView programming environment
PVA850 SPECIFICATIONS
Gantry System Design
Closed loop brushless DC servo motors, ball screw slide, and optical encoders on all axes
Work Area
1 Valve:
330 mm x 350 mm x 101 mm
(13.0" x 13.78" x 4.0")
Footprint
1219 mm x 1041 mm x 1606 mm
(48 in x 41" x 63.22")
Weight
509 kg (1122.15 lbs.)
Air Supply
10 cfm at > 80 psi (5.5 bar) filtered at 5 microns
Power
208 – 240 VAC, 50 – 60 Hz
PVA850 Accuracy: 25 microns (0.001")
XYZ Placement Accuracy: 50 microns (0.002")
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XYZ Specifications
XYZ Repeatability: 25 microns (0.001")
Maximum Speed (XYZ): 1750 mm/sec (68.9"/sec)
Maximum Acceleration: 2g
Encoder Resolution (XY): 2.5 microns
Encoder Resolution (Z): 1.25 microns
Z Axis Sensing: Tactile or CCD laser
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Standard Features
Active vision system with fiducial recognition and correction
Automatic XYZ calibration
Non-contact laser height sensor, touch probe optional
PathView™ Programming Software
Onboard PC with flat screen monitor
Light tower |
Dispensing Methods
FCM200: Non-contact micro bead, dot
SVX: Servo auger valve, bead, dot, high accuracy
SV100: Servo auger valve, bead, dot
FC100-MC: Needle valve
SD5000: Servo driven syringe pump
Material Feed Options: Syringe
Pressure vessel
Bulk feed cartridge (6 – 20 oz.)
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Board Handling
Conveyor Type: Flat belt or chain
Minimum Conveyor Width: 50 mm (1.97")
Above Board Clearance: 55 mm (2.17")
Under Board Clearance: 20 mm (0.79")
Transport Height: 940 mm – 965 mm (37" – 38")
Communication Protocol: SMEMA
Conveyor Options: Lift and locate edge clamp, under board locating pins, or vacuum support
Number of Heated Zones: Up to3
Heating Zone Options: Contact or non-contact convection heat up to 150° C
Conveyor Speed Up to 24.4m/min (80 ft/min)
Process Flow Left to right (standard), optional right to left or bidirectional
Weight Limit Belt - 5 lbs (2.2kg)
Chain - 15 lbs (6.8kg) |
Optional Features
Dual head tooling
Board heating
Valve heating
Bar code program selection
Automatic conveyor width adjust
Low level fluid sensors
Interior lighting
Dual lane conveyors
Dual head tooling |
