
Bonding
The application of a liquid adhesive to join two surfaces, such as metal, plastic, glass, rubber, or ceramic, together which forms a complete bond and transfers forces between the substrates.
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While PVA is known globally for its world-class dispensing and conformal coating equipment, what truly sets us apart from our competitors is our technical knowledge and award-winning service.
We understand our customers have different goals and limitations. That’s why we combine our application expertise with innovative dispensing robotics and precision valve technology to deliver each client a custom-built solution that revolves around their manufacturing needs.
PVA’s product line satisfies a range of processes and applications for both large and small manufacturing lines. Our extensive selection of automation, valves, and accessories ensures a comprehensive application solution from start to finish.
Our customers always have access to our team of experts along with our global service and support so they can continue to innovate as the manufacturing landscape evolves.
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The application of a liquid adhesive to join two surfaces, such as metal, plastic, glass, rubber, or ceramic, together which forms a complete bond and transfers forces between the substrates.
The application of a protective film or layer of liquid onto a PCB, either in selected areas or over the entire assembly. Conformal coatings are applied using an array of technologies such as atomized spray, airless film, needle dispense and jetting.
Dispensing can extend across numerous industries and applications that require dosing in an accurate and controlled manner. PVA's award winning valves and pumps are available to dispense a broad spectrum of chemistries to meet the requirements of your most demanding applications.
A thermal interface material ("TIM") fills gaps between mating surfaces with a substance that improves thermal conductivity beyond the air that would have otherwise filled that gap. The TIM acts as a conductive bridge that greatly improves heat transfer between between a heat-generating device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).