Find out what sets PVA apart from other suppliers of fluid dispensing and conformal coating equipment.
We understand our customers have different goals and limitations. That’s why we combine our application expertise with innovative dispensing robotics and precision valve technology to deliver each client a custom-built solution that revolves around their manufacturing needs.
PVA’s product line satisfies a range of processes and applications for both large and small manufacturing lines. Our extensive selection of automation, valves, and accessories ensures a comprehensive application solution from start to finish.
Our customers always have access to our team of experts along with our global service and support so they can continue to innovate as the manufacturing landscape evolves.
The application of a protective film or layer of liquid onto a PCB, either in selected areas or over the entire assembly. Conformal coatings are applied using an array of technologies such as atomized spray, airless film, needle dispense and jetting.
Dispensing can extend across numerous industries and applications that require dosing in an accurate and controlled manner. PVA's award winning valves and pumps are available to dispense a broad spectrum of chemistries to meet the requirements of your most demanding applications.
Also known as "form-in-place gasketing," this application dispenses one or two-part liquids into a groove or onto a flange that will cure to form a seal against liquids and gases. This automated process eliminates the task of assembling a die cut or pre-made gasket. Additionally, geometries can easily be modified for other designs.
The process of applying an optically clear liquid to a digital display, such as LCD or plasma, to bond a cover glass and/or touch sensor to eliminate the air gap between each layer. This provides improved image clarity, especially in outdoor or bright light environments, improved resistance to shock and vibration, and additional protection against dust and moisture.
A thermal interface material ("TIM") fills gaps between mating surfaces with a substance that improves thermal conductivity beyond the air that would have otherwise filled that gap. The TIM acts as a conductive bridge that greatly improves heat transfer between between a heat-generating device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).