The application of a liquid adhesive to join two surfaces, such as metal, plastic, glass, rubber, or ceramic, together which forms a complete bond and transfers forces between the substrates.

The application of a protective film or layer of liquid onto a PCB, either in selected areas or over the entire assembly. Conformal coatings are applied using an array of technologies such as atomized spray, airless film, needle dispense and jetting.

Applying an epoxy or silicone-based fluid that completely covers a defined area around a flip chip or wire bonded component. This provides mechanical shock and vibration stability, as well as environmental protection from moisture and foreign objects.

Also known as "form-in-place gasketing," this application dispenses one or two-part liquids into a groove or onto a flange that will cure to form a seal against liquids and gases. This automated process eliminates the task of assembling a die cut or pre-made gasket. Additionally, geometries can easily be modified for other designs.

The process of filling an enclosure that holds electronic circuitry, with a liquid that when cured completely encases the unit. This provides mechanical stability during shock and vibration as well as environmental protection from moisture and foreign objects.

The application of a fluid along one or more edges of an electronic component, such as a flip chip or BGA type package, that flows underneath using capillary action. Underfill is used to prevent thermal mismatch between the component and the substrate, prevent moisture penetration, and to provide mechanical stability during shock and vibration.