PDP
Conformal Coating, Dispensing, Encapsulation & Glob Top, Gasketing, Potting, Staking, Thermal Interface Materials
What is Dam and Fill?
Dam and Fill is a two-step process of first dispensing a high viscosity fluid around the perimeter of a device or electronic circuitry, and then dispensing a low viscosity fluid within the perimeter to fully encase the components. The dam can be applied as a single or multi-layer bead depending on the target fill height required.
When to Use Dam and Fill
A dam and fill process is ideal for encapsulating an area of components or a wire bonded die. This process can precisely control the wetted area of a PCB during this stage of assembly.
Using a silicone material during the process adds higher shock and thermal resistance than a conformal coating process.
Benefits of Dam and Fill
- High shock and vibration resistance
- Water and moisture resistance
- Controlled filling compound
- Materials vary widely
- Use in small and large areas
- Stronger than conformal coating
Questions about your dam and fill process?
Talk to the PVA ExpertsRecommended Dam and Fill Valves
PVA offers a wide variety of valves ideal for any dam and fill application.
PDP
FC100 Series
PCP
SV200
Dam & Fill Videos
FC100-MC for Optimized Dam and Fill Applications
