Applying an epoxy or silicone-based fluid that completely covers a defined area around a flip chip or wire bonded component. This provides mechanical shock and vibration stability, as well as environmental protection from moisture and foreign objects.
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CA300

CAM200

Delta 6

Delta 8

DX100 Series

FC100 Series

FC300 Series

FCM100

FCM200

Flex Cell

PC100

PC200R-SS

PVA350

Sigma

SV200
