Applying an epoxy or silicone-based fluid that completely covers a defined area around a flip chip or wire bonded component. This provides mechanical shock and vibration stability, as well as environmental protection from moisture and foreign objects.
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CA300
CAM200
Delta 6
Delta 8
DX100 Series
FC100 Series
FC300 Series
FCM100
FCM200
Flex Cell
PC100
PC200R-SS
PVA350
