SVX
Dam & Fill, Dispensing, Encapsulation & Glob Top, Gasketing, Staking, Surface Mount Adhesive / Solder Paste
Encapsulation involves covering an electronic assembly or component with a compound to protect the device from mechanical stress, moisture, corrosion, and foreign debris.
Encapsulation is used to apply an epoxy or silicone-based fluid that completely covers a defined area around a flip chip or wire bonded component. The encapsulation process provides components with shock and heat resistance for harsh environments leading to longer product reliability. Encapsulation can be very similar to potting, however is utilized to protect a device without the presence of a case or frame.
PVA offers a wide variety of valves ideal for your encapsulation process.