A thermal interface material (“TIM”) fills gaps between mating surfaces with a substance that improves thermal conductivity beyond the air that would have otherwise filled that gap.   The TIM acts as a conductive bridge that greatly improves heat transfer between between a heat-generating device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).

White Papers

View all
View all

Products

View all
View all