A two-step process of first dispensing a high viscosity fluid around the perimeter of a device or electronic circuitry, and then dispensing a low viscosity fluid within the perimeter to fully encase the components. The dam can be applied as a single or multi-layer bead depending on the target fill height required.

Dispensing can extend across numerous industries and applications that require dosing in an accurate and controlled manner.  PVA's award winning valves and pumps are available to dispense a broad spectrum of chemistries to meet the requirements of your most demanding applications.

Also known as "form-in-place gasketing," this application dispenses one or two-part liquids into a groove or onto a flange that will cure to form a seal against liquids and gases. This automated process eliminates the task of assembling a die cut or pre-made gasket. Additionally, geometries can easily be modified for other designs.

The process of filling an enclosure that holds electronic circuitry, with a liquid that when cured completely encases the unit. This provides mechanical stability during shock and vibration as well as environmental protection from moisture and foreign objects.

A thermal interface material ("TIM") fills gaps between mating surfaces with a substance that improves thermal conductivity beyond the air that would have otherwise filled that gap. The TIM acts as a conductive bridge that greatly improves heat transfer between between a heat-generating device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).