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SD100 Syringe Dispense Valve product shot
    SD100 Syringe Dispense Valve product shot
  • SD100 Syringe Dispense Valve product shot

SD100

Dispensing, Encapsulation & Glob Top, Gasketing, Potting, Staking, Surface Mount Adhesive / Solder Paste, Thermal Interface Materials, Underfill

Syringe Dispense Valve

The SD100 dispense valve is designed as a simple tool to provide clean dispense on/off control for dispensing directly from syringes. The SD100 has a low-profile design utilizing a two position pneumatic actuator to control a disposable stopcock valve that is attached directly to the bottom of the syringe. No tools are needed to change out the valve, just loosen 2 thumb screws and replace the worn fluid path. A wide range of syringe sizes can be used and a robust holder will secure the syringe during high-speed operation.

The SD100 can be used with low to high viscosity fluids with a long or short pot life, even with fillers. Examples are grease, oil, RTV, epoxy, solder paste, encapsulant, and thermal interface materials.

The SD100 has many additional integrated features including:

  • Disposable material path
  • Standard luer lock outlet
  • Compatible with syringes up to 70 cc
  • Tool-less change out of fluid path
  • Two position pneumatic actuator
  • Optional low level sensor

Resources

Datasheets

Brochures

Applications

Underfill dispensing application on a circuit board

Dispensing

Dispensing can extend across numerous industries and applications that require dosing in an accurate and controlled manner.  PVA's award winning valves and pumps are available to dispense a broad spectrum of chemistries to meet the requirements of your most demanding applications.

Dispensing Details
Encapsulation in action

Encapsulation & Glob Top

Applying an epoxy or silicone-based fluid that completely covers a defined area around a flip chip or wire bonded component. This provides mechanical shock and vibration stability, as well as environmental protection from moisture and foreign objects.

Encapsulation & Glob Top Details
Gasketing solutions in action

Gasketing

Also known as "form-in-place gasketing," this application dispenses one or two-part liquids into a groove or onto a flange that will cure to form a seal against liquids and gases. This automated process eliminates the task of assembling a die cut or pre-made gasket. Additionally, geometries can easily be modified for other design.

Gasketing Details
Potting in action

Potting

The process of filling an enclosure that holds electronic circuitry, with a liquid that when cured completely encases the unit. This provides mechanical stability during shock and vibration as well as environmental protection from moisture and foreign objects.

Potting Details
PDP Staking Application in action

Staking

Staking is an application that involves dispensing a bead of adhesive to bridge a component and a circuit board surface to create an anchor for additional support.

Staking Details
Solder Paste in action

Surface Mount Adhesive / Solder Paste

Surface Mount Adhesive (SMA), solder paste, and filled epoxies require accurate deposits to adhere SMT components to a PCB surface. Consistent dot or bead profiles are critical for bonding a broad range of components with a growing emphasis on miniaturization that is achievable with jetting valves or auger pumps.

Surface Mount Adhesive / Solder Paste Details
Thermal Interface Material in action

Thermal Interface Materials

A thermal interface material (“TIM”) fills gaps between mating surfaces with a substance that improves thermal conductivity beyond the air that would have otherwise filled that gap. The TIM acts as a conductive bridge that greatly improves heat transfer between between a heat-generating device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).

Thermal Interface Materials Details
Underfill in action

Underfill

The application of a fluid along one or more edges of an electronic component, such as a flip chip or BGA type package, that flows underneath using capillary action. Underfill is used to prevent thermal mismatch between the component and the substrate, prevent moisture penetration, and to provide mechanical stability during shock and vibration.

Underfill Details