Dispensing can extend across numerous industries and applications that require dosing in an accurate and controlled manner.  PVA's award winning valves and pumps are available to dispense a broad spectrum of chemistries to meet the requirements of your most demanding applications.

Applying an epoxy or silicone-based fluid that completely covers a defined area around a flip chip or wire bonded component. This provides mechanical shock and vibration stability, as well as environmental protection from moisture and foreign objects.

The process of filling an enclosure that holds electronic circuitry, with a liquid that when cured completely encases the unit. This provides mechanical stability during shock and vibration as well as environmental protection from moisture and foreign objects.

Surface Mount Adhesive (SMA), solder paste, and filled epoxies require accurate deposits to adhere SMT components to a PCB surface.  Consistent dot or bead profiles are critical for bonding a broad range of components with a growing emphasis on miniaturization that is achievable with jetting valves or auger pumps.

A thermal interface material ("TIM") fills gaps between mating surfaces with a substance that improves thermal conductivity beyond the air that would have otherwise filled that gap. The TIM acts as a conductive bridge that greatly improves heat transfer between between a heat-generating device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).