PVA & MacDermid Alpha Workshop Schedule
10:00 AM – 10:20 AM
Welcome and Coffee: MAES and PVA Team Presentation
10:20 AM – 10:30 AM
MacDermid Alpha Electronics Solutions Portfolio, Presented by MacDermid Alpha: Key technologies and applications in Electronic Assembly
10:30 AM – 11:00 AM
Conformal Coatings, Presented by PVA & MacDermid Alpha: Types, benefits, and compatibility with PVA equipment
11:00 AM – 11:20 AM
Potting Materials, Presented by PVA & MacDermid Alpha: Rigid vs. flexible solutions with PVA equipment
11:20 AM – 11:30 AM
Break
11:30 AM – 12:00 PM
TIMs (Thermal Interface Materials), Presented by PVA & MacDermid Alpha: Thermal management and success stories
12:00 PM – 12:30 PM
Underfill and Edge Bonding, Presented by PVA & MacDermid Alpha: Mechanical protection and automation
12:30 PM – 1:00 PM
Reliance Tool®, Presented MacDermid Alpha: Compatibility = reliability
1:00 PM – 2:00 PM
Lunch
2:00 PM – 2:30 PM
PVA Product Portfolio Presented by PVA
2:30 PM – 3:00 PM
Live Demonstrations, PVA Dispensing Equipment
PVA Mexico Headquarters
Spanning an impressive 6,824 square feet, the new Applications Lab in Guadalajara is strategically designed to mirror the successful setups at PVA’s headquarters in New York and PVA Europe’s Helmond lab. This replication ensures that customers in Mexico gain convenient access to top-notch customer service and technical support without the need for extensive travel.
Address:
Camino al Cucba #175. Nave -#81
Col Venta del Astillero 45221
Zapopan, Jal., Mexico
Applications
Conformal Coating
The application of a protective film or layer of liquid onto a PCB, either in selected areas or over the entire assembly. Conformal coatings are applied using an array of technologies such as atomized spray, airless film, needle dispense and jetting.
Potting
The process of filling an enclosure that holds electronic circuitry, with a liquid that when cured completely encases the unit. This provides mechanical stability during shock and vibration as well as environmental protection from moisture and foreign objects.
Thermal Interface Materials
A thermal interface material (“TIM”) fills gaps between mating surfaces with a substance that improves thermal conductivity beyond the air that would have otherwise filled that gap. The TIM acts as a conductive bridge that greatly improves heat transfer between between a heat-generating device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
Underfill
The application of a fluid along one or more edges of an electronic component, such as a flip chip or BGA type package, that flows underneath using capillary action. Underfill is used to prevent thermal mismatch between the component and the substrate, prevent moisture penetration, and to provide mechanical stability during shock and vibration.
Contact
Halfmoon, NY 12065