
Bonding
The application of a liquid adhesive to join two surfaces, such as metal, plastic, glass, rubber, or ceramic, together which forms a complete bond and transfers forces between the substrates.
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PVA offers a range of meter mix dispensing pumps designed to meet the needs of your application along with the chemistry and viscosity of your material.
Each product in the PVA suite of meter mix pumps can be tailored to your solution. Our pumps include the Servo Piston Pump, Servo Cartridge Pump, Servo Gear Pump, and Progressive Cavity Pump. Additionally, we offer automated dispensing systems including our Endurance Cart and Servo Metering Rod System.
Our precision pumps have been uniquely engineered to accommodate various applications including dispensing, gasketing, potting, and thermal interface materials. We offer solutions for your most demanding two-component dispensing applications.
Learn more about PVA’s line of meter mix dispensing pumps and systems below.
SPP |
SCTP |
SGP |
PDP |
SMR |
|
---|---|---|---|---|---|
Description |
Independent Servo Drives (Variable Ratio) |
Material Directly from Linear DriveSEMCO Cartridge Assemblies20 oz and 32 oz Cartridge Options |
Independent Servo Drives (Variable Ratio) |
Independent Servo Drives (Variable Ratio)Positive Displacement MeterServo Controlled Rotor |
Independent Servo Drives (Variable Ratio) |
Material |
Ideal for Moisture Sensitive Fluids |
Works Well with All Materials |
Unfilled or Lightly Filled Fluid Dispensing Applications with Ranging Viscosities |
Works Well with a Wide Range of Viscous Chemistries |
Works Well with Most All Materials Regardless of Viscosity or Ratio |
Applications |
Thermal Interface Materials (TIM) |
Single or Two-Component Meter Mix Applications |
Single or Two-Component Meter Mix Applications |
Demanding Two Component Dispensing Applications |
Two Component Dispensing Applications |
Special Notes |
Commonly Used with Low-Medium Viscosity Where Continuous Flow isn’t Required |
Ideal for Thermal Conductive Adhesives with Aggressive Fillers |
Not Ideal for Materials with Aggressive or High Concentration of Filler Materials |
Carbide Rotor Available for Extended Life When Processing Filled or Abrasive Chemistries |
Ideal for Two-Component Materials with Abrasive Fillers |
Features & Benefits |
Long Service Life Under Adverse ConditionsNo Contact with Atmosphere Keeps Seals Lubricated and Free from Material Crystallization |
No Moving Components or SealsLow MaintenanceDisposable and Maintenance Free |
Near 100% Volumetric EfficiencyPrecise Dispensing in a Wide Variety of Shot Volumes and Flow RatesEngineered to Match Ratio for Improved Resolution to Optimize Ratio Repeatability |
Superior Volumetric AccuracyDrip-Free OperationLess Moving Parts, Less MaintenanceMix at the Nozzle TechnologyFive Rotor Sizes |
Fully Programmable Servo Metering RodRod Pump TechnologyEliminates Scrubbing |
Research meter mix to decide which solution best fits your process.
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The application of a liquid adhesive to join two surfaces, such as metal, plastic, glass, rubber, or ceramic, together which forms a complete bond and transfers forces between the substrates.
Dispensing can extend across numerous industries and applications that require dosing in an accurate and controlled manner. PVA's award winning valves and pumps are available to dispense a broad spectrum of chemistries to meet the requirements of your most demanding applications.
Also known as "form-in-place gasketing," this application dispenses one or two-part liquids into a groove or onto a flange that will cure to form a seal against liquids and gases. This automated process eliminates the task of assembling a die cut or pre-made gasket. Additionally, geometries can easily be modified for other designs.
The process of filling an enclosure that holds electronic circuitry, with a liquid that when cured completely encases the unit. This provides mechanical stability during shock and vibration as well as environmental protection from moisture and foreign objects.
A thermal interface material ("TIM") fills gaps between mating surfaces with a substance that improves thermal conductivity beyond the air that would have otherwise filled that gap. The TIM acts as a conductive bridge that greatly improves heat transfer between between a heat-generating device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).