Flex Cell
Conformal Coating, Dam & Fill, Dispensing, Encapsulation & Glob Top, Gasketing, Potting, Surface Mount Adhesive / Solder Paste, Thermal Interface Materials, Underfill
Trusted Automation for Flight and Beyond
In aerospace and space applications, every gram and every micron counts. PVA brings over 30 years of experience to this highly demanding sector with precision dispensing and conformal coating systems that meet rigorous performance and safety standards. Whether protecting sensitive avionics from extreme conditions or bonding components for launch and satellite systems, our solutions are trusted for their reliability and repeatability.
PROCESS SOLUTIONS FOR AEROSPACE & NEW SPACE
Solar Panel and Power System Assembly
PVA’s glassing, bonding, and encapsulation technologies support the production of aerospace-grade solar panels, from bonding solar cells to full panel lamination.
Advanced PCB and Satellite Electronics Protection
PVA delivers underfill, staking, conformal coating, and bonding solutions to protect large and sensitive PCBs used in satellite systems, antennas, and space-grade electronics.
Display and Cockpit Interface Integration
From cockpit displays to flight deck controls, PVA provides conformal coating, potting, and optical bonding systems that enhance screen durability, protect internal components, and improve clarity under dynamic conditions.
EV Aircraft Battery Assembly and Protection
For electric aircraft and eVTOL vehicles, PVA offers foam potting and bonding solutions that insulate high-voltage batteries and secure cells into compact, lightweight packs.
AEROSPACE AND NEW SPACE APPLICATIONS
PVA offers valve technology, custom automation, and fluid delivery solutions for the following applications.
Bonding
The application of a liquid adhesive to join two surfaces, such as metal, plastic, glass, rubber, or ceramic, together which forms a complete bond and transfers forces between the substrates.
Conformal Coating
The application of a protective film or layer of liquid onto a PCB, either in selected areas or over the entire assembly. Conformal coatings are applied using an array of technologies such as atomized spray, airless film, needle dispense and jetting.
Encapsulation & Glob Top
Applying an epoxy or silicone-based fluid that completely covers a defined area around a flip chip or wire bonded component. This provides mechanical shock and vibration stability, as well as environmental protection from moisture and foreign objects.
Optical Bonding
The process of applying an optically clear liquid to a digital display, such as LCD or plasma, to bond a cover glass and/or touch sensor to eliminate the air gap between each layer. This provides improved image clarity, especially in outdoor or bright light environments, improved resistance to shock and vibration, and additional protection against dust and moisture.
Potting
The process of filling an enclosure that holds electronic circuitry, with a liquid that when cured completely encases the unit. This provides mechanical stability during shock and vibration as well as environmental protection from moisture and foreign objects.
Underfill
The application of a fluid along one or more edges of an electronic component, such as a flip chip or BGA type package, that flows underneath using capillary action. Underfill is used to prevent thermal mismatch between the component and the substrate, prevent moisture penetration, and to provide mechanical stability during shock and vibration.
Aerospace and New Space Products
Browse our range of automation and dispensing equipment for your aerospace and new space manufacturing process.
Flex Cell
Delta 8
Delta 6
DeltaBond
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Our team of PVA application experts are here to help with your next manufacturing process.