Flex Cell
Conformal Coating, Dam & Fill, Dispensing, Encapsulation & Glob Top, Gasketing, Potting, Surface Mount Adhesive / Solder Paste, Thermal Interface Materials, Underfill
Precision, cleanliness, and repeatability are essential in medical device manufacturing—and PVA delivers. Our automated dispensing, coating, and potting solutions are designed to meet the stringent requirements of Class I, II, and III devices, enabling consistent quality and regulatory compliance across your production line.
PVA supports the medical device industry with validated, cleanroom-ready automation solutions designed to meet the highest standards of precision, sterility, and traceability.
For devices like insulin pumps and glucose monitors, PVA provides highly accurate conformal coating and underfill processes that protect delicate components while maintaining compact form factors.
PVA supports the assembly of surgical devices, stents, balloons, and needles with advanced bonding techniques including case bonding for housings and structural integrity.
PVA delivers precise conformal coating, potting, and bonding solutions for critical diagnostic equipment such as blood analyzers, glucose sensors, and patient monitors.
From bonding oxygen masks to assembling well plates for culture sampling, PVA’s dispensing and bonding solutions deliver consistent accuracy and repeatability.
PVA offers valve technology, custom automation, and fluid delivery solutions for the following applications.
The application of a liquid adhesive to join two surfaces, such as metal, plastic, glass, rubber, or ceramic, together which forms a complete bond and transfers forces between the substrates.
The application of a protective film or layer of liquid onto a PCB, either in selected areas or over the entire assembly. Conformal coatings are applied using an array of technologies such as atomized spray, airless film, needle dispense and jetting.
Dispensing can extend across numerous industries and applications that require dosing in an accurate and controlled manner. PVA's award winning valves and pumps are available to dispense a broad spectrum of chemistries to meet the requirements of your most demanding applications.
The process of filling an enclosure that holds electronic circuitry, with a liquid that when cured completely encases the unit. This provides mechanical stability during shock and vibration as well as environmental protection from moisture and foreign objects.
The application of a fluid along one or more edges of an electronic component, such as a flip chip or BGA type package, that flows underneath using capillary action. Underfill is used to prevent thermal mismatch between the component and the substrate, prevent moisture penetration, and to provide mechanical stability during shock and vibration.
Browse our range of automation and dispensing equipment for your medical device manufacturing process.
Our team of PVA application experts are here to help with your next manufacturing process.