Flex Cell
Conformal Coating, Dam & Fill, Dispensing, Encapsulation & Glob Top, Gasketing, Potting, Surface Mount Adhesive / Solder Paste, Thermal Interface Materials, Underfill
Precision for 5G and Beyond
The rapid expansion of telecom infrastructure demands speed, reliability, and miniaturization. PVA enables manufacturers to meet these demands with precision automation systems for bonding, coating, and sealing components in high-frequency and high-density telecom devices.
PROCESS SOLUTIONS FOR TELECOMMUNICATIONS AND CONNECTIVITY
PVA empowers the telecommunications industry with advanced dispensing, coating, and gasketing solutions designed for high-reliability data and signal transmission.
EMI/RFI Shielding for Signal Integrity
PVA’s automation systems employ EMI and RFI gasketing solutions to help maintain signal clarity and prevent interference.
Outdoor Radio and 5G Tower Components
PVA provides conformal coating for telecommunications towers and housings, including 5G and radio towers.
Network Infrastructure Hardware
From large-scale routers to network servers, PVA delivers bonding, staking, gasketing, and thermal interface material (TIM) dispensing to ensure high-speed data performance and heat management.
Fabric and Switch Cards Assembly
PVA supports staking and surface mount processes for fabric cards and switches, enabling high-density circuit board assembly in network routing and switching hardware.
Telecommunications and Connectivity Applications
PVA offers valve technology, custom automation, and fluid delivery solutions for the following applications.
Bonding
The application of a liquid adhesive to join two surfaces, such as metal, plastic, glass, rubber, or ceramic, together which forms a complete bond and transfers forces between the substrates.
Conformal Coating
The application of a protective film or layer of liquid onto a PCB, either in selected areas or over the entire assembly. Conformal coatings are applied using an array of technologies such as atomized spray, airless film, needle dispense and jetting.
Gasketing
Also known as "form-in-place gasketing," this application dispenses one or two-part liquids into a groove or onto a flange that will cure to form a seal against liquids and gases. This automated process eliminates the task of assembling a die cut or pre-made gasket. Additionally, geometries can easily be modified for other design.
Staking
Staking is an application that involves dispensing a bead of adhesive to bridge a component and a circuit board surface to create an anchor for additional support.
Surface Mount Adhesive / Solder Paste
Surface Mount Adhesive (SMA), solder paste, and filled epoxies require accurate deposits to adhere SMT components to a PCB surface. Consistent dot or bead profiles are critical for bonding a broad range of components with a growing emphasis on miniaturization that is achievable with jetting valves or auger pumps.
Thermal Interface Materials
A thermal interface material (“TIM”) fills gaps between mating surfaces with a substance that improves thermal conductivity beyond the air that would have otherwise filled that gap. The TIM acts as a conductive bridge that greatly improves heat transfer between between a heat-generating device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
Telecommunications and Connectivity Products
Browse our range of automation and dispensing equipment for your telecommunications or connectivity manufacturing process.
Flex Cell
Delta 8
Delta 6
PVA350
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Our team of PVA application experts are here to help with your next manufacturing process.